Pick and Place System Dima Modulo MP-100
Specifications
Germany
Description
Platinum thickness: 0.5-4.5mm, component height: top max. 16mm, bottom max. 30mm, components: Chip, MELF, SOT, SOIC, TSOP, PLCC, QFP, BGA, LCC, µBGA etc., Incremental axes X: 0.001mm, Y: 0.001mm, Z: 0.02mm, theta: 0.045°, connected load: 2500W, operating temperature: 18-30°C, control: microprocessor control with CAN interface, operated on PC with Windows® 7, vision system: ESI CorePlace®, automatic board alignment, complete component identification, inspection of solder pads, pin positions, component position, BGA ball count etc., weight: 700kg. On-site inspection is possible.
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